Structure of conductive layers in multilayer substrates for mini

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428601, 428901, 156 87, B32B 326, B32B 3100

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active

050615475

ABSTRACT:
A multilayer substrate provides predetermined connections to and between a plurality of integrated circuit chips mounted thereon. A plurality of layers mounted on a surface of a substrate has a plurality of layers comprising a plurality of dielectric layers, a first plurality of metallic layers, and a second plurality of metallic layers. The first plurality of metallic layers has a predetermined pattern for forming the predetermined connections, these being the x-lines and y-lines. Each of the second plurality of metallic layers provides a predetermined voltage level to the integrated circuit chips, and each of the second metallic layers has a screen-like structure. Each of the first and second metallic layers is insulated from the other metallic layers by one of the dielectric layers, except for desired interconnections between the x-lines y-lines, and power layer (or power plane).

REFERENCES:
patent: 4350545 (1982-09-01), Garabedian
patent: 4489119 (1984-12-01), Ishige et al.
patent: 4522667 (1985-06-01), Hanson et al.

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