Structure of circuit board and method for fabricating same

Details Structure of circuit board and method for fabricating same Structure of circuit board and method for fabricating same

2011-03-15

2011-03-15

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23174, C257S700000, C257S786000, C438S629000, C438S637000, C361S306300

Reexamination Certificate

active

07906850

ABSTRACT:
A circuit board structure and a method for fabricating the same are proposed. The structure includes an insulating protective layer having a plurality of openings in which conductive vias are formed, a patterned circuit layer formed on the surface of the insulating protective layer and electrically connected to the conductive vias in the openings of the insulating protective layer, and a dielectric layer formed on the insulating protective layer and on the surface of the patterned circuit layer, wherein a plurality of openings are formed in the dielectric layer to thereby expose parts of the patterned circuit layer. Accordingly, the present invention reduces the thickness of a circuit board, which reduces package size, improves product performance, and conforms to the developmental trend toward smaller electronic devices.

REFERENCES:
patent: 5627406 (1997-05-01), Pace
patent: 6740965 (2004-05-01), Hsu et al.
patent: 6764931 (2004-07-01), Iijima et al.
patent: 6897544 (2005-05-01), Ooi et al.
patent: 6914322 (2005-07-01), Iijima et al.
patent: 6921977 (2005-07-01), Shimizu et al.
patent: 6943442 (2005-09-01), Sunohara et al.
patent: 2005/0052822 (2005-03-01), Shimizu et al.

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