Structure of chip type electrolytic capacitor

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

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Details

C361S535000, C361S536000, C361S537000, C361S517000, C361S518000, C361S519000

Reexamination Certificate

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06898066

ABSTRACT:
The present invention relates to a structure of chip type electrolytic capacitor, which comprises a casing cover and a partition to separate space of casing cover into a dielectric chamber and a buffer chamber, a dielectric which includes lead pins, holes on the partition for the lead pins pass through. The dielectric is installed in the dielectric chamber, and lead pins pass through the holes on partition and extend to the buffer chamber. The buffer chamber is sealed with a bottom cover which also includes holes for lead pins. A stuff of epoxide is filled into the buffer chamber to fix the dielectric and its lead pins. A top cover is to seal the dielectric chamber for filling electrolyte. The casing cover is made with high strength engineering plastic by plastic injection machine. A supersonic welding and the epoxide adhesive solidification package technologies replace rubber packing. This skill of the art can enhance airtight and reduce volume of chip type electrolytic capacitor to anti shock and electrolyteleaking.

REFERENCES:
patent: 5650759 (1997-07-01), Hittman et al.
patent: 5847919 (1998-12-01), Shimizu et al.
patent: 6118646 (2000-09-01), Yang et al.
patent: 6292348 (2001-09-01), Lin
patent: 6442014 (2002-08-01), Lin

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