Structure of charged coupled device

Details Structure of charged coupled device Structure of charged coupled device

1991-10-11

1994-06-14

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361728, 361772, 257673, 257676, 257692, 257704, H01L 2302

Patent

active

053212045

ABSTRACT:
A CCD package and a method for assembling a CCD package utilizing a TAB process. The method comprises the steps of preparing a tape for TAB which has outer leads, inner leads and die bonding paddles, bonding a chip on the paddles and then bonding the free ends of the inner leads on the bonding pads of the chip, connecting the inner leads and the outer leads through insulations, adding a light shield layer beneath the chip, and attaching a glass lid to the surface portions of the inner leads positioned just above the chip. Accordingly, packages of light, laminated and simple structure can be obtained, thereby advantageously enabling the compactness of products utilizing CCD elements. Also, the process is also simplified, thereby decreasing the cost of producing CCD elements.

REFERENCES:
patent: 3706409 (1972-12-01), Lederer
patent: 4209355 (1980-06-01), Burns
patent: 4680618 (1987-07-01), Kuroda et al.
patent: 4766479 (1988-08-01), Krum et al.
patent: 4806503 (1989-02-01), Yoshida et al.
patent: 4907061 (1990-03-01), Kottara
Tummala, et al., Microelectronics Packaging Handbook, "Plastic Packaging Process," Van Nostrand Peinhold Publ., pp. 637-638 (No date is available).
Kyocera Catalog, Ceramic Package, pp. 2-3. (No date is available).
Seraphim, Principles of Electronic Package, Chapter 10, McGraw Hill, (No date is available).

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