Structure of a thermally and electrically enhanced plastic pin g

Details Structure of a thermally and electrically enhanced plastic pin g Structure of a thermally and electrically enhanced plastic pin g

1994-11-01

1997-04-29

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361752, H01L 2302

Patent

active

056251661

ABSTRACT:
An integrated circuit package that contains a multi-layer printed circuit board that is coupled to a plurality of external mounting pins and an integrated circuit. The multi-layered circuit board has a plurality of inner bonding pads that are coupled to the integrated circuit and routed directly to the pins without use of any vias. The printed circuit board has multiple voltage/ground layers so that different power levels can be supplied to the integrated circuit board. The integrated circuit is mounted and electrically grounded to a heat slug that is also coupled to the printed circuit board. The heat slug provides the dual function of a ground plane and a thermal sink for the package. The pins and package are typically configured in a conventional PPGA package arrangement.

REFERENCES:
patent: 5102829 (1992-04-01), Cohn
patent: 5130889 (1992-07-01), Hambergen et al.
patent: 5357672 (1994-10-01), Newman

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