Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With guide for directing panel circuit movement
Reexamination Certificate
1999-06-17
2001-11-06
Sircus, Brian (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With guide for directing panel circuit movement
Reexamination Certificate
active
06312262
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an improved structure of a plastic CPU foldable fixing frame, and especially to a computer CPU fixing frame made of plastic material, thereby the radiator of the CPU and the grounding wire of the mother board is conducted and the interference to the signal wave is reduced. Therefore, the running speed of the computer is incremented.
2. Description of the Prior Art
The prior art plastic CPU foldable fixing frame is a plastic product, which has bad heat and electric conductivities. Thus, the heat dissipation effect is low, and the running speed of CPU will be dramatically effected. Moreover, other then the inner crystal circuit, the housing of a CPU is nonconductive, thus the ability of preventing electromagnetic interference is bad. The prior art plastic CPU foldable fixing frame substantially has a bad effect than one made of metal. However, the plastic product is beneficial in cost and thus in commercial competition. Therefore, there is an eager demand for a novel plastic CPU foldable fixing frame, by which the defects in the prior art can be improved.
SUMMARY OF THE INVENTION
Accordingly, the object of the present invention is to provide an improved structure of a plastic CPU foldable fixing frame, wherein a conductive structure is installed in the plastic fixing frame so that the radiator of the CPU and the grounding wire of the mother board will conduct. Thus, the heat dissipating effect is increased and the electromagnetic interference within the CPU may be reduced. Therefore, the running speed of CPU is increased.
In order to attain the aforementioned object, the present invention provides an improved structure of a plastic CPU foldable fixing frame primarily comprises a seat and two foldable plates which are pivotally installed at two sides of the seat, a CPU is contained and fixed between the two foldable plates. The plastic CPU foldable fixing frame primarily comprises a seat and two foldable plates which are pivotally installed at two sides of the seat, a CPU is contained and fixed between the two foldable plates. The seat is formed by two bases symmetric in the left and right sides to be directly fixed to a mother board. A communicated tank is located at the bottom of each of the two bases near the inner lateral surface of the CPU receiving tank. Each of the communicated tank is buckled to a respective CPU receiving tank, so that the force applied point of the conductive elastic piece is along the direction of the CPU receiving tank in the inner side of the base.
As the aforementioned structure is assembled, the CPU fixing frame on the base is fixed to the mother board by a screw or a rivet, the conductive elastic piece will be connected to the ground wire of the mother board by fixing to the screw or the rivet. Thus, as assembling a CPU, the force applied point of the conductive elastic piece will be in contact with the radiator on the outer surface of the CPU, then by the screw and the ground wire of the mother board, they are electrically connected. Thus, the signal interference from the high-speed transformation of the signal in a computer is reduced, further, the running speed of the CPU is increased.
The present invention will be better understood and its numerous objects and advantages will become apparent to those skilled in the art by referencing to the following drawings in which:
REFERENCES:
patent: 5928024 (1999-07-01), Ming-Huang
patent: 5980299 (1999-11-01), Davis
patent: 6031725 (2000-02-01), Scholder et al.
patent: 6074231 (2000-06-01), Ju
patent: 6083026 (2000-07-01), Trout et al.
patent: 6089899 (2000-07-01), Wang et al.
patent: 6089900 (2000-07-01), Ma
patent: 6111747 (2000-08-01), Jeffries et al.
Le Thanh-Tam
Rosenberg , Klein & Lee
Sircus Brian
Wiesen Electronic Co., Ltd.
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