Electrical connectors – With coupling movement-actuating means or retaining means in... – Including compound movement of coupling part
Reexamination Certificate
2001-10-09
2003-06-03
Ta, Tho D. (Department: 2833)
Electrical connectors
With coupling movement-actuating means or retaining means in...
Including compound movement of coupling part
C439S070000, C439S083000
Reexamination Certificate
active
06572397
ABSTRACT:
BACKGROUND OF THE INVENTION
(
a
) Field of the Invention
The present invention relates to an improved structure of a ball grid array IC socket connection with solder ball, and in particular, an IC socket having a plurality of conductive clipping plates with clipping solder ball structure so as to eliminate the requirement of pre-soldering of solder ball onto the conductive clipping plates.
(
b
) Description of the Prior Art
Ball Grid Array IC socket is a new IC socket structure with solder balls to replace the insertion pins protruded from the bottom of the socket, and surface mounting technology is employed to mount the corresponding soldering position of the solder balls over the surface of the circuit board.
FIG. 1
is a perspective view of Ball Grid Array CPU socket.
FIG. 2A
is a bottom view of the socket shown in FIG.
1
and
FIG. 2B
is an enlarged view of a portion of FIG.
2
A. The number of mounting pins of the corresponding IC pins of the socket is changed to a socket with semi-engaging solder balls
11
,
12
,
13
such that the bottom surface of the CPU socket
10
is protruded half the height of that of the solder balls
11
,
12
,
13
.
FIG. 3
is a perspective view of a conventional Ball Grid Array CPU socket connected with solder ball. Within the socket
10
, corresponding to IC pins, a plurality of straight slots
20
,
21
,
22
are formed. Each straight slot
20
,
21
,
22
is squeezed with a bending, U-shaped conductive clipping plate
30
which is an elastic thin strap. The bottom end of the conductive clipping plate
30
does not protrude from the bottom of the socket
10
, and a solder ball
40
is mounted to the bending section of the plate
30
such that the upper half portion of the solder ball
40
is engaged at the straight slot
20
and is mounted to the conductive clipping plate
30
, and the lower half portion of the solder ball
40
is used for future mounting to a circuit board
50
at the soldering point. At an appropriate position on the two side walls of the conductive clipping plate
30
, at least a pair of clipping walls
31
,
32
is provided for clipping with the IC pins
61
,
62
of a top transverse board
60
mounted onto the socket
10
. This conductive plate
30
together with the ball solder
40
has the following drawbacks:
(1) A soldering process is required to pre-mount the solder ball onto a conductive clipping plate and after that when the CPU socket is be adhered to the circuit board, the solder ball has to be heated again, and accordingly, repeating of soldering processes is troublesome and the fabrication processes cannot be expedite; and
(2) Due to numerous soldering points, chances of pollution due to air pollutant are increased and therefore the quality of conductivity at the soldered point is lowered, and further, the connection structure of the solder ball is inappropriate.
Accordingly, it is an object of the present invention to provide an improved structure of a Ball Grid Array IC socket connection with solder ball which mitigates the above drawbacks.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an improved structure of a Ball Grid Array IC socket connection with solder ball, wherein the Ball Grid Array IC socket connecting solder ball having a plurality of conductive plates corresponding to IC pins is characterized in that the conductive plates are flexible bent plate bodies for insertion and clipping with the IC pins, and the other end of the plate body for insertion into the IC pins is formed into a branching opening for elastically clipping of the solder ball so that the solder ball is securely clipped and the other end of the plate body is formed into a bending wall for insertion into the IC pin.
Yet another object of the present invention is to provide an improved structure of a ball grid array IC socket connection with solder ball, wherein a wall block is provided to an IC socket and a straight through slot is provided to the wall block and the plate body is exactly secured by the through slot, preventing the plate body being dislocated from the through hole of the wall block.
Other object and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 6056558 (2000-05-01), Lin et al.
patent: 6142792 (2000-11-01), Yang
patent: 6217348 (2001-04-01), Lin et al.
Harvey James
Lei Leong C.
Lotes Co., Ltd.
Ta Tho D.
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