Structure in a microelectronic device including a bi-layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S760000, C257S751000, C257S752000, C257S774000

Reexamination Certificate

active

09820079

ABSTRACT:
The invention relates to a microelectronic device and a structure therein that includes a diffusion barrier layer having a first thickness and a first dielectric constant. An etch stop layer is disposed above and on the diffusion barrier layer. The etch stop layer has a second thickness and a second dielectric constant.

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patent: 6429119 (2002-08-01), Chao et al.
patent: 6448654 (2002-09-01), Gabriel et al.
patent: 2002/0090806 (2002-07-01), Kie
patent: 2004/0207091 (2004-10-01), Wang et al.
Michael E. Clarke, “Introducing Low-k Dielectrics into Semiconductor Processing,” Mykrolis Applications Notes (2004) p. 5.
S. Bains, “Nanostructured Dielectrics Good Candidates for Next Generation Computer Chips,” OE Reports, No. 194 (Feb. 2000) pp. 1-3.
Donald G. Fink, and John M. Carroll, “Standard Handbook for Electrical Engineers,” McGraw-Hill Book Co., New York (1969) pp. 2-30-2-31.
Stanley Wolf, “Silicon Processing for the VLSI Era, vol. 4—Deep-Submicron Process Technology,” Lattice Press, Sunset Beach, CA, (2002), p. 641.

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