Structure having embedded flush circuitry features and...

Details Structure having embedded flush circuitry features and... Structure having embedded flush circuitry features and...

2005-01-11

2005-01-11

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S901000, C174S250000, C174S257000

Reexamination Certificate

active

06841228

ABSTRACT:
Embedded flush circuitry features are provided by depositing a conductive seed layer on the front side of a sacrificial carrier; plating a layer of conductive metal onto the seed layer and personalizing circuitry features. The front side of the carrier film is embedded into a dielectric material and the sacrificial carrier film is removed.

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Patent Abstracts of Japan, Application No. 09068383, 10/98, Sony Corp., Manufacture of Printed Wiring Board.

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