Structure having different levels of programmable integrated cir

Details Structure having different levels of programmable integrated cir Structure having different levels of programmable integrated cir

1993-12-22

1996-08-06

Trans, Vincent N.

Boots, shoes, and leggings

364488, 34082583, 326 38, 326 41, H03K 17693

Patent

active

055440690

ABSTRACT:
A structure for interconnecting electronic components contains a group of first programmable integrated circuits (331-1-331-3 and 331-5-331-7), at least one second programmable integrated circuit (331-4) and at least one substrate (300), typically a printed circuit board. The first programmable integrated circuits are connected through conductive traces to component contacts formed on the substrate(s) for receiving the electronic components. The first programmable integrated circuits are also connected through bus lines (333-1-333-3 and 333-5-333-7) to the second programmable integrated circuit(s). The electronic components are thereby interconnected through the combination of the first and second programmable integrated circuits.

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