Structure for thin film interconnect

Details Structure for thin film interconnect Structure for thin film interconnect

1993-01-21

2000-12-26

Nguyen, Ngoc-Yen

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428624, 428660, 428661, 428458, B32B 1508

Patent

active

061656291

ABSTRACT:
This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

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R. P. King, et al., "Screening Masks and Method of Fabrication" IBM Technical Disclosure Bulletin, vol. 20, No. 2, pp. 577-578 (Jul. 1977).
U.S. Patent Application Serial No. 07/503,401 filed on Mar. 30, 1990 entitled "Low TCE Polyimides" (IBM Docket No. FI9-90-012).
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U.S. Patent Application Serial No. 07/740,760 filed on Aug. 5, 1991 entitled "Low RCE Polyimides as Improved Insulator in Multilayer Interconnect Structures" (IBM Docekt No. FI9-91-086).

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