Structure for testing bare integrated circuit devices

Details Structure for testing bare integrated circuit devices Structure for testing bare integrated circuit devices

1996-02-21

1998-06-09

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324762, G01R 3102

Patent

active

057640700

ABSTRACT:
A test probe structure for making connections to a bare integrated circuit device or a wafer to be tested comprises a multilayer printed circuit probe arm which carries at its tip an MCM-D type substrate having a row of microbumps on its underside to make the required connections. The probe arm is supported at a shallow angle to the surface of the device or wafer, and the MCM-D type substrate is formed with the necessary passive components to interface with the device under test. Four such probe arms may be provided, one on each side of the device under test.

REFERENCES:
patent: 4827211 (1989-05-01), Strid et al.
patent: 4998062 (1991-03-01), Ikeda
patent: 5177439 (1993-01-01), Liu et al.
patent: 5355079 (1994-10-01), Evans et al.
patent: 5442300 (1995-08-01), Nees et al.

Affiliated with

Also associated with

Rating

Structure for testing bare integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure for testing bare integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure for testing bare integrated circuit devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2204550