Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-05-10
2001-04-17
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C024S625000, C248S510000, C257S719000, C361S719000
Reexamination Certificate
active
06219238
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to semiconductor device packaging. In particular, the present invention relates to a structure and method for removably attaching a heat sink to an electronic package, and particularly, a surface mount package.
BACKGROUND OF THE INVENTION
Typically, electronic devices, such as semiconductor chips are attached or mounted to various structures to facilitate their installation in a machine, such as a computer. For example, a chip may be mounted on a lead frame, chip support, or other such structure that may ultimately be interconnected with a circuit board or circuit card. A part of the packaging often includes a heat sink to dissipate heat generated by operation of the chip or other semiconductor device.
As chip density and speed of integrated circuit chips increases, chips often require high performance surface mount packages assembled very close to each other on circuit cards. These packages dissipate heat and, since they are packed very close to each other, they become hot. One of the most commonly used methods of cooling package is to attach heat sinks to the packages.
SUMMARY OF THE INVENTION
The present invention provides a structure for removably attaching a heat sink to an electronic package. The structure includes at least one heat sink engaging member for engaging a surface of the heat sink opposite a surface of the heat sink that engages the electronic package. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past at least a portion of a side of the heat sink and at least a portion of the electronic package and a second arm extending from the first member for engaging the electronic package.
The present invention also provides an electronic package. The electronic package includes a semiconductor chip, a heat spreader plate that the chip is attached to, and a heat sink. The electronic package also includes an attachment structure for removably attaching the heat sink to the spreader plate. The attachment structure includes at least one heat sink engaging member for engaging the surface of the heat sink opposite a surface of the heat sink that engages the heat spreader plate. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past at least a portion of a side of the heat sink and at least a portion of a side of the heat spreader plate and a second arm extending from the first arm for engaging the heat spreader plate.
The present invention also provides a method of removably attaching a heat sink to an electronic package. The method includes arranging a heat sink on a surface of an electronic package. An attachment structure is provided for removably attaching a heat sink to the heat spreader plate. The attachment structure includes at least one heat sink engaging member for engaging a surface of the heat sink opposite a surface of the heat sink that engages the heat spreader plate. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past at least a portion of a side of the heat sink and at least a portion of a side of the heat spreader plate and a second arm extending from the first arm for engaging the electronic package. The attachment structure of the present invention is arranged over the heat sink and the electronic package is engaged with the second arm of the attachment structure.
Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
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Andros Frank E.
Gaynes Michael A.
Shaukatullah Hussain
Storr Wayne R.
Connolly Bove & Lodge & Hutz LLP
International Business Machines - Corporation
Tolin Gerald
LandOfFree
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