Structure for protecting electronic packaging contacts from...

Details Structure for protecting electronic packaging contacts from... Structure for protecting electronic packaging contacts from...

2006-09-06

2010-06-08

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S679000, C257S737000, C257SE23116, C257SE23178

Reexamination Certificate

active

07732928

ABSTRACT:
A structure for protecting electronic package contacts is provided. The structure includes at least an electronic contact mounted on a chip, a dielectric layer, a conductor trace line and a protective layer. The protective layer is used to prevent stresses from being gathered within electronic contacts on the chip through surroundingly covering the conductor trace line.

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