Structure for preventing burnt fuse pad from further...

Details Structure for preventing burnt fuse pad from further... Structure for preventing burnt fuse pad from further...

2005-08-09

2005-08-09

Jackson, Stephen W. (Department: 2836)

Electricity: electrical systems and devices

Safety and protection of systems and devices

Circuit interruption by thermal sensing

C361S103000

Reexamination Certificate

active

06927964

ABSTRACT:
A semiconductor device with a capability can prevent a burnt fuse pad from re-electrical connection, wherein the semiconductor device includes a bump pad and a fuse pad over a wafer. The fuse pad includes the burnt fuse pad having a gap for electrical isolation. The semiconductor device comprises a dielectric layer, disposed substantially above the burnt fuse pad and filling the gap, and a bump structure, disposed on the bump pad. The foregoing semiconductor device can further comprise a passivation layer, which exposes the bump pad and a portion of the burnt fuse pad. Wherein, the dielectric layer is over the passivation layer, covers the exposed portion of the burnt fuse pad and fills the gap.

REFERENCES:
patent: 6566730 (2003-05-01), Giust et al.
patent: 6664142 (2003-12-01), Liu
patent: 6667195 (2003-12-01), Liu
patent: 6756256 (2004-06-01), Tong et al.

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