Structure for precision multichip assembly

Details Structure for precision multichip assembly Structure for precision multichip assembly

1998-06-01

2000-02-15

Williams, Alexander Oscor

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

257797, 257619, 257420, 257730, 257723, 257685, H01L 23538, H01L 2334

Patent

active

060256389

ABSTRACT:
Process for making an integrated circuit module and product thereof including a carrier supporting a plurality of precisely aligned semiconductor circuit chips having uniform thicknesses.

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