Structure for multilayer circuits

Details Structure for multilayer circuits Structure for multilayer circuits

1977-04-29

1980-02-19

Goolkasian, John T.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

29625, 174 685, 428213, 428457, 428448, 428901, 428450, 428630, G23P 300, B32B 1306

Patent

active

041895240

ABSTRACT:
To reduce the proportion of rejects resulting by reasons of short circuits in the manufacture and use of miniaturized multilayer circuits and to improve the electric efficiency, there is inserted between each conductive layer of low resistance and each insulating layer of high thermal stability, a very thin layer of a conductive material, preferably non-magnetic, of high resistivity and of crystallographic reference at least compatible with respect to the first conducting material and of low or negligible thermal expansion in the range of temperatures to which the circuits are submitted both during manufacture and use.

REFERENCES:
patent: 3079282 (1963-02-01), Haller et al.
patent: 3189420 (1965-06-01), Gould
patent: 3357856 (1967-12-01), Ragan et al.
patent: 3499218 (1970-03-01), Dahlgren et al.

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