Structure for mounting semiconductor package

Details Structure for mounting semiconductor package Structure for mounting semiconductor package

2011-07-19

2011-07-19

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679540, C361S704000, C361S709000, C361S710000, C165S080300, C165S104330, C165S185000, C257S712000, C257S718000, C257S719000, C174S016300, C174S252000

Reexamination Certificate

active

07983048

ABSTRACT:
A mounting structure, in which semiconductor package1and heat sink8for dissipating heat generated from semiconductor package1are mounted on mounting board3. The rear surface of semiconductor package1is bonded to the front surface of mounting board3facing the rear surface. Heat sink8is brought into contact with the rear surface of semiconductor package1via through-ole5formed on mounting board3. Semiconductor package1and heat sink8are pressed to each other by the elastic force of clip6.

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