Structure for mounting a semiconductor device

Details Structure for mounting a semiconductor device Structure for mounting a semiconductor device

1988-08-16

1990-08-14

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

361398, 439 69, H05K 114

Patent

active

049492241

ABSTRACT:
Semiconductor devices are mounted to a circuit board three-dimensionally by using a tape carrier film with device-connecting electrodes formed on both sides. Bump electrodes are formed on the devices and they are connected individually to these device-connecting electrodes each of which is connected to one of terminal electrodes on the circuit board. The film has throughhole conductors at places to electrically connect bump electrodes on opposite sides of the film.

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William H. C. Hui, Integration Techniques For Electronically Active Elements and Circuits, RCA Tech. Notes, Jul. 1967.

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