Structure for loading substrate in substrate bonding...

Details Structure for loading substrate in substrate bonding... Structure for loading substrate in substrate bonding...

2007-11-20

2010-11-23

Aftergut, Jeff H (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S381000, C156S382000

Reexamination Certificate

active

07836934

ABSTRACT:
A substrate bonding apparatus for use in fabricating LCD devices substantially prevents substrates held to upper stages from sagging. The substrate bonding apparatus may, for example, include upper and lower stages having a plurality of passages for holding respective substrates; suction force applying means having one end mounted within each passage for transmitting a suction force to operably proximate portions of a substrate, wherein the one end of the suction force applying means is projectable from within each passage to a predetermined distance from the stage; and a vacuum pump for providing a suction force to the suction force applying means.

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