Structure for joining a wire to a solid electrolytic element

Details Structure for joining a wire to a solid electrolytic element Structure for joining a wire to a solid electrolytic element

1991-11-18

1993-02-16

Tung, T.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204427, 204429, G01N 27406, G01N 27407

Patent

active

051868091

ABSTRACT:
In the joining structure of the solid electrolytic element, terminals connected to the heating element and the electrodes are attached through metallic oxide layers onto the solid electrolytic layer. The thermal conductivity coefficient of the metallic oxide layers is larger than that of the solid electrolytic layer. The thermal expansion coefficient of the metallic oxide layers is the same as or smaller than that of the solid electrolytic layer. Consequently, when the lead wires are soldered to the terminals, heat is quickly conducted to the terminals, enhancing the fluidity and the solderability of the soldering material. Since excess heating is not required for soldering, the solid electrolytic layer is prevented from deteriorating due to heat. Since a low-melting solder is not used, the joining structure has high heat resistance. Moreover, during soldering, the metallic oxide layers do not detach from the solid electrolytic layer due to heat.

REFERENCES:
patent: 3616413 (1971-10-01), Reichner
patent: 3843400 (1974-10-01), Radford et al.
patent: 4310401 (1982-01-01), Stahl
patent: 4334974 (1982-06-01), Muller et al.
patent: 4502939 (1985-03-01), Holfelder et al.
patent: 4668375 (1987-05-01), Kato et al.
patent: 4769123 (1988-09-01), Mase et al.
Hackh's Chemical Dictionary, 4th ed., (1969), p. 623.

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