Structure for coupling plural substrates

Details Structure for coupling plural substrates Structure for coupling plural substrates

1990-03-27

1991-05-21

Pirlot, David L.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 60, H05K 100

Patent

active

050171461

ABSTRACT:
A structure for coupling a plurality of substrates includes at least two transverse parallel substrates on which connectors are fixed so that their coupling motion is effected perpendicularly of major surfaces of the substrate. The structure further includes a longitudinal substrate on which connectors are fixed at front and rear different positions so that their coupling motion is effected in a parallel direction with a major surface of the substrate. When the longitudinal substrate is mounted to the transverse substrates, with their connectors being coupled together, structural and electrical connection between the longitudinal substrate and the transverse substrates is established simultaneously.

REFERENCES:
patent: 4818239 (1989-04-01), Erk
patent: 4859191 (1989-08-01), Tonooka et al.
patent: 4907977 (1990-03-01), Porter
patent: 4934941 (1990-06-01), Okada

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