Structure for coupling between low temperature circuitry and roo

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

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165185, 257675, 361704, H01L 3900

Patent

active

059774797

ABSTRACT:
There is disclosed a structure for coupling between a low temperature circuitry cooled by a cooling system and a room temperature circuitry wherein the structure contains a device for electric connection and a second cooling system specifically for cooling of the electric connection.

REFERENCES:
patent: 4619316 (1986-10-01), Nakayama et al.
patent: 4739633 (1988-04-01), Faris
patent: 4805420 (1989-02-01), Porter et al.
patent: 4950181 (1990-08-01), Porter
patent: 5028988 (1991-07-01), Porter et al.
patent: 5070701 (1991-12-01), Saeki et al.
patent: 5075555 (1991-12-01), Woldseth et al.
patent: 5153803 (1992-10-01), Rapeaux et al.
patent: 5166777 (1992-11-01), Kataoka

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