Structure for circuit assembly

Details Structure for circuit assembly Structure for circuit assembly

2006-08-17

2010-06-01

Andújar, Leonardo (Department: 2826)

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

C349S139000, C349S150000, C257S059000, C257S797000

Reexamination Certificate

active

07728945

ABSTRACT:
A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.

REFERENCES:
patent: 5404239 (1995-04-01), Hirai
patent: 5982468 (1999-11-01), Satou et al.
patent: 6683594 (2004-01-01), Mori et al.
patent: 6744638 (2004-06-01), Terasaka
patent: 7339646 (2008-03-01), Izawa et al.
patent: 7403257 (2008-07-01), Shin et al.
patent: 2004/0156006 (2004-08-01), Uehara
patent: 2005/0099565 (2005-05-01), Shin et al.
patent: 2006/0141744 (2006-06-01), Best et al.
patent: 0 738 998 (1996-10-01), None
patent: WO2004/044966 (2004-05-01), None
patent: 460095 (2001-10-01), None
patent: 496113 (2002-07-01), None

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