Structure for attaching a heat sink to a semiconductor device

Details Structure for attaching a heat sink to a semiconductor device Structure for attaching a heat sink to a semiconductor device

1995-10-24

1997-08-26

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165 803, 165185, 257707, 257713, 257718, 257797, 361717, 361718, 361722, H05K 720

Patent

active

056616392

ABSTRACT:
In a structure for attaching a heat sink to a semiconductor device in which a frame is encapsulated in a resin mold, a pin is formed integrally with the semiconductor device, and a hole engageable with the pin is formed integrally with the heat sink.

REFERENCES:
patent: 4460917 (1984-07-01), Rogers
patent: 4646203 (1987-02-01), Ngo et al.
patent: 4710852 (1987-12-01), Keen
patent: 5175668 (1992-12-01), Kendel
patent: 5488539 (1996-01-01), Testa et al.

Affiliated with

Also associated with

Rating

Structure for attaching a heat sink to a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure for attaching a heat sink to a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure for attaching a heat sink to a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1992520