Structure for assembling a heat sink assembly

Details Structure for assembling a heat sink assembly Structure for assembling a heat sink assembly

2002-04-04

2003-08-19

Leo, Leonard R (Department: 3743)

Heat exchange

With repair or assembly means

Guide

C165S080300, C165S185000, C174S016300, C257S722000, C361S704000

Reexamination Certificate

active

06607023

ABSTRACT:

FIELD OF THE INVENTION
The invention herein relates to a structure for assembling a heat sink assembly for CPU dissipation, more specifically, to an improved heat sink assembly structure with interlocking devices for the assembling structure being interlocked in both horizontal and vertical direction.
BACKGROUND OF THE INVENTION
Due to the continuous development of computer technology and the enhancement of integrated circuit production technology, CPU execution speeds are always increasing. Thus, the amount of heat generated rises in direct proportion. If the rate of CPU heat dissipation is insufficient, the computer operating stability will be affected. As a result, the most direct and easy solution for solving the problem of CPU overheating is to use a heat sink assembly to dissipate the high temperature produced by the CPU.
The conventional heat sink currently available has two mainly type. As shown in
FIG. 1A
, which is constructed of a single piece of extruded aluminum with a plurality of heat sink fins
1
a
and a base plate
1
b
. Due to the limitations of mold removal and extrusion technology, the heat sink fins
1
a
are thicker, which not only results in a larger area of dissipating inefficiency, but also a slower rate of heat conduction and. Furthermore, since the distance d between the heat sink fins is overly large, the number of heat sink fins
1
a
is less, and the overall heat dissipation area is small, there is another negative effect on the rate of heat dissipation by the heat sink. Besides, the procedure of aluminum extrusion finishing process is complex, and resulting not only in slowing down the fabrication speed, but also wasting material consumption when cutting and shaving.
Also available on the current market is a structure of assembling heat sink, as shown in the U.S. Pat. No.: 6,104,609, please referring to the
FIG. 1B
, which interlocks the heat sinks
1
by a hook
11
and a female interlocking slot
12
thereon. However, this structure of interlocking device
10
only provides for interlocking in the horizontal direction. As a result, the heat sink assembly may fall off in the vertical direction when assembling due to the lacking means for interlocking in the vertical direction.
In view of the various disadvantages of conventional heat dissipation devices in terms of heat sink design structure, the present invention addresses the disadvantages by researching solutions for them which, following continuous research and improvements, culminated in the development of the improved structure for assembling a heat sink assembly of the invention herein, a structure capable of eliminating the numerous drawbacks of the conventional technology.
SUMMARY OF THE INVENTION
The present invention provides a structure for assembling a heat sink assembly using at least an interlocking device to assemble at lease a heat sink fin, the improvement of said interlocking device comprising a female slot, a protruding hook, and an opening hole, wherein said protruding hook of each first heat sink fin wedges into said female slot of an adjacent first heat sink fin by the shape of said protruding hook corresponding to said female slot, and said protruding hook of each first heat sink fin having a barb portion for hooking said opening hole of said adjacent first heat sink fin to assemble said heat sink fins for interlocking completely in the vertical direction.


REFERENCES:
patent: 2434676 (1948-01-01), Spender
patent: 5558155 (1996-09-01), Ito
patent: 6104609 (2000-08-01), Chen
patent: 6336498 (2002-01-01), Wei
patent: 6340056 (2002-01-01), Huang et al.
patent: 6382307 (2002-05-01), Wang et al.
patent: 6449160 (2002-09-01), Tsai
patent: 6474407 (2002-11-01), Chang et al.

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