Structure computer central processing unit heat dissipater

Details Structure computer central processing unit heat dissipater Structure computer central processing unit heat dissipater

1999-04-12

2000-08-15

Pacard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361694, 361704, 257718, 257719, 257721, 257722, 174 161, 174 163, 165 803, H05K 720

Patent

active

061046094

ABSTRACT:
An improved structure computer central processing unit heat dissipater, more specifically a computer central processing unit heat dissipation structure having modular heat sink element capability. The present invention is comprised of a fan, an upper cover, a heat sink assembly, and a lower cover, wherein the heat sink assembly is composed of numerous metal heat sink elements that are interlock-assembled together front to back in a flush arrangement. The thickness of the heat sink elements are thinner than that of conventional structures, while each element has a hook and a slot for purposes of assembly. Furthermore, an intervallic channel for the air flow heat dissipation area is formed between the conjoined hooks and slots. There is a concave-sectioned surface at the center section to reduce air resistance and interference as well as heat conduction fins along the bottom sections to enhance the contact area with the heat source at the lower cover to thereby increase heat conduction efficiency. As such, the improved structure of the invention herein increases fan performance and accelerates the rate of heat dissipation, allowing the central processing unit to function under optimal operating temperature conditions for the duration of operation and, furthermore, offers additional computer utilization stability.

REFERENCES:
patent: 3480837 (1969-11-01), Feldmann
patent: 3536960 (1970-10-01), Otteson et al.
patent: 5038858 (1991-08-01), Jordan et al.
patent: 5558155 (1996-09-01), Ito
patent: 5828551 (1998-10-01), Hoshino et al.
patent: 5864464 (1999-01-01), Lin
patent: 5940269 (1999-08-01), Ko et al.
patent: 5943210 (1999-08-01), Lee et al.

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