Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2005-06-28
2005-06-28
Talbot, Brian K. (Department: 1762)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S097900, C438S633000, C438S643000, C438S653000, C438S675000, C438S687000, C438S680000, C204S192100, C204S192150
Reexamination Certificate
active
06911229
ABSTRACT:
An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interlayer is provided.
REFERENCES:
patent: 6136693 (2000-10-01), Chan et al.
patent: 6204204 (2001-03-01), Paranjpe et al.
patent: 6251781 (2001-06-01), Zhou et al.
patent: 6294836 (2001-09-01), Paranjpe et al.
patent: 6362099 (2002-03-01), Gandikota et al.
patent: 6495200 (2002-12-01), Chan et al.
Andricacos Panayotis C.
Boettcher Steven H.
McFeely Fenton Read
Paunovic Milan
Connolly Bove & Lodge & Hutz LLP
Talbot Brian K.
Trepp Robert M.
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