Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-06-06
2006-06-06
Zarneke, David A. (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
Reexamination Certificate
active
07057293
ABSTRACT:
A structure of the present invention has a printed circuit board having a land portion provided on a surface thereof on which a solder paste is printed in such a condition that, with respect to a lengthwise direction of a connecting terminal of an electronic component to be connected to the land portion, the solder paste projects outward from an edge of the land portion on the side of a front end of the connecting terminal and/or the solder paste is withdrawn toward inside the edge of the land portion on the side of a rear end of the connecting terminal. Solder projecting from the edge of the land portion on the side of the front end of the connecting terminal is used for forming a fillet by which the front end of the connecting terminal is surely covered. Also, as the solder paste is withdrawn from the edge of the land portion on the side of the rear end of the connecting terminal, any extra solder except for the solder indispensable for forming a soldered joint is not generated.
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Taiwanese Office Action dated Nov. 7, 2003 wtih English translation of pertinent portions.
Japanese Copyright 2003 APIPA dated Sep. 26, 1994.
Abstract pf the Disclosure.
European Search Report dated Apr. 1, 2004.
Vincent et al., “Lead-Free Solders for Electronic Assembly”; The GEC Journal of Research; vol. 11, No. 2;1 1994; pp. 76-89.
XP-002275694 & TW362342A (Sony Video Taiwan Co. Ltd.); Jun. 21, 1999; 1 p.
Igarashi Makoto
Sakai Hiroshi
Suzuki Motoji
Tanaka Akihiro
NEC Corporation
Whitman Curtis & Christofferson, PC
Zarneke David A.
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