Structure combining an IC integrated substrate and a...

Details Structure combining an IC integrated substrate and a... Structure combining an IC integrated substrate and a...

2011-08-09

2011-08-09

Estrada, Michelle (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S463000, C438S464000, C257SE23001, C257SE21499, C257SE33056

Reexamination Certificate

active

07993973

ABSTRACT:
The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The interface between the IC integrated substrate and the carrier has a specific area at which the interface adhesion is different from that at the remaining area of the interface. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electronic devices using the above structure.

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