Structure and method to form a heat sink

Details Structure and method to form a heat sink Structure and method to form a heat sink

2007-11-02

2010-10-05

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S679540, C361S709000, C361S719000, C165S080200, C165S185000, C174S016300, C257S713000, C257S719000, C029S890030

Reexamination Certificate

active

07808789

ABSTRACT:
The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.

REFERENCES:
patent: 6127724 (2000-10-01), DiStefano
patent: 7063127 (2006-06-01), Gelorme et al.
patent: 7254034 (2007-08-01), Bolle et al.
patent: 7365984 (2008-04-01), Jeong
patent: 2002/0154483 (2002-10-01), Homer et al.
patent: 2007/0210438 (2007-09-01), Briere et al.
IBM Technical Database account No. NN9403225.

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