Structure and method of making strained channel CMOS...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – Having specific type of active device

Reexamination Certificate

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C257S206000

Reexamination Certificate

active

06906360

ABSTRACT:
A structure and method are provided in which an n-type field effect transistor (NFET) and a p-type field effect transistor (PFET) each have a channel region disposed in a single-crystal layer of a first semiconductor and a stress is applied at a first magnitude to a channel region of the PFET but not at that magnitude to the channel region of the NFET. The stress is applied by a layer of a second semiconductor which is lattice-mismatched to the first semiconductor. The layer of second semiconductor is formed over the source and drain regions and extensions of the PFET at a first distance from the channel region of the PFET and is formed over the source and drain regions of the NFET at a second, greater distance from the channel region of the NFET, or not formed at all in the NFET.

REFERENCES:
patent: 5268324 (1993-12-01), Aitken et al.
patent: 5583059 (1996-12-01), Burghartz
patent: 6358806 (2002-03-01), Puchner
patent: 2004/0175872 (2004-09-01), Yeo et al.
Nayak, Deepak K. et al.;“High-Mobility Strained-Si PMOSFET's,”IEEE Transactions On Electron Devices, vol. 43, No. 10, Oct. 1996, pp. 1709-1716.

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