Structure and method of direct chip attach

Details Structure and method of direct chip attach Structure and method of direct chip attach

2006-08-29

2006-08-29

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C257SE21526, C257SE21521

Reexamination Certificate

active

07098051

ABSTRACT:
A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and remainder of the bond wire is removed. Locations (23) for attaching the wire bond ball are recorded with reference to fiducials (5) on the lead frame. The encapsulation covers the die, deposits and die attach flag (24) of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings (17) for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.

REFERENCES:
patent: 6555401 (2003-04-01), Koduri
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6976616 (2005-12-01), Mano et al.
patent: 2005/0064697 (2005-03-01), Ference et al.

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