Structure and method for wire lead attachment to a high temperat

Details Structure and method for wire lead attachment to a high temperat Structure and method for wire lead attachment to a high temperat

1985-12-02

1988-07-19

Albritton, C. L.

Electrical resistors

Resistance value responsive to a condition

Gas, vapor, or moisture absorbing or collecting

338309, 338314, 338329, H01L 700

Patent

active

047588144

ABSTRACT:
A first layer of titanium or tin is vapor deposited upon opposing major surfaces on the ceramic sensor. A second layer consisting of platinum, palladium or ruthenium is deposited over the first layer. The structure is then preferably annealed in air in order to crystallize the external layer to roughen the exterior surface and enhance adhesion. Lead wires, preferably made of Nichrome, are attached to the opposing surfaces by applying a conductive paste to the wire and surface functions, and firing the structure. The conductive paste provides a relatively low resistance, strong, mechanical bond between the lead wires and the roughened external surfaces of the structure. The first layer facilitates bonding of the second layer to the ceramic. The first and second layers cooperate to protect the ceramic from the potentially harmful glass frit contained in the conductive paste.

REFERENCES:
patent: 2836885 (1958-06-01), Macdonald et al.
patent: 3339267 (1967-03-01), Bronnes et al.
patent: 3728660 (1973-08-01), Finney
patent: 3767370 (1973-09-01), Ornstein
patent: 3929426 (1975-04-01), Blust et al.
patent: 3970235 (1976-03-01), Blust et al.
patent: 3975307 (1976-08-01), Matsuo et al.
"High Temperature Metal Ceramic Seals", Ceramic Age, vol. 63-64, No. 4, Apr., 1957.

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