Structure and method for releasing stressy metal films

Details Structure and method for releasing stressy metal films Structure and method for releasing stressy metal films

2005-12-15

2008-03-18

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S697000, C438S706000, C057S117000, C057S117000

Reexamination Certificate

active

07344906

ABSTRACT:
A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.

REFERENCES:
patent: 6544430 (2003-04-01), McCormack et al.
patent: 2006/0196613 (2006-09-01), Lamontagne et al.
patent: 2007/0062264 (2007-03-01), Wang et al.

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