Structure and method for reducing thermal stresses on a...

Details Structure and method for reducing thermal stresses on a... Structure and method for reducing thermal stresses on a...

2007-07-10

2007-07-10

Spector, David (Department: 2873)

Optical: systems and elements

Optical modulator

Having particular chemical composition or structure

Reexamination Certificate

active

11232604

ABSTRACT:
Method and structure for mounting a torsional hinged device, such as a mirror, having a first TCE (thermal coefficient of expansion) on a substrate having a second TCE different than said first TCE. The structure comprising a plurality of compliant support posts between the substrate and the torsional hinged device that deform when the contraction and/or expansion of the torsional hinged device is different than the corresponding contraction and expansion of the substrate.

REFERENCES:
patent: 6563106 (2003-05-01), Bowers et al.
patent: 6885493 (2005-04-01), Ljungblad et al.
patent: 6894823 (2005-05-01), Taylor et al.
patent: 6964196 (2005-11-01), Turner et al.
patent: 7034982 (2006-04-01), Doan
patent: 7092143 (2006-08-01), Heureux

Affiliated with

Also associated with

Rating

Structure and method for reducing thermal stresses on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure and method for reducing thermal stresses on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and method for reducing thermal stresses on a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3779328