Structure and method for reducing slip in semiconductor wafers

Details Structure and method for reducing slip in semiconductor wafers Structure and method for reducing slip in semiconductor wafers

1998-03-03

2000-08-08

Beck, Shrive

Coating apparatus

Gas or vapor deposition

118725, 156345, 117200, 4272481, C23C 1600

Patent

active

060996501

ABSTRACT:
A semiconductor chemical vapor deposition reactor includes a susceptor and a cover above the susceptor to reflect and radiate heat from the susceptor back onto the top surfaces of the wafers held on the susceptor, thereby minimizing temperature gradients on the wafers and reducing slip. The cover has an opening in the center through which process gases are injected, creating a Bernouli effect to draw the process gases between the cover and susceptor, where the process gases then deposit on the wafers secured thereon.

REFERENCES:
patent: 4579080 (1986-04-01), Martin et al.
patent: 5685906 (1997-11-01), Dietze et al.

Affiliated with

Also associated with

Rating

Structure and method for reducing slip in semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure and method for reducing slip in semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and method for reducing slip in semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1146539