Structure and method for providing a lead frame with enhanced so

Details Structure and method for providing a lead frame with enhanced so Structure and method for providing a lead frame with enhanced so

1993-09-22

1995-08-22

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257779, H01L 2748, H01L 2946, H01L 2944, H01L 2952

Patent

active

054442931

ABSTRACT:
A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder wetting can take place when bonded to conductive traces of a printed circuit board. In one embodiment, the thickness of the tip of the lead is reduced to further the area over which soldering wetting takes place. In that embodiment, the exposed base metal area is reduced by 85 percent.

REFERENCES:
patent: 4099200 (1978-07-01), Koutalides
patent: 4920074 (1990-04-01), Shimizu et al.

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