Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-10-02
1999-11-09
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438124, 438119, 257788, 257789, 257795, H01L 2144, H01L 2329
Patent
active
059813130
ABSTRACT:
The packaging structure for a semiconductor device according to this invention is formed by mounting a semiconductor chip 1 on a wiring board 4 to connect it to the electrodes 5 of the wiring board 4, and filling a sealing resin 7, obtained by mixing a filler material 8 for lowering the coefficient of thermal expansion in a base resin, in the gap formed between the semiconductor device and the wiring board. The sealing resin 7 is separated to a first part 9 with small amount of the filler material and is composed mostly of the base resin, and a second part 10 with an amount of the filler material more than in the first part. With this constitution, the second part is consists of a material with smaller coefficient of thermal expansion than that of the first part. The first part and the second part are separated after completion of the filling of the sealing resin 7. The separation can be carried out with high efficiency by utilizing the centrifugal force produced in the rotation of the entirety of the semiconductor device and the wiring board.
REFERENCES:
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5668059 (1997-09-01), Christie et al.
patent: 5717477 (1998-02-01), Fritz et al.
Toshiyasu Shimada et al., "Leadless Bare Chip attachment Technology for Low-Cost MCM-L", Microjoining and assembly Technology in Electronics, Feb. 1-2, 1996, pp. 193-196.
"General Electronic Components for Packaging", Nikkei Micro-devices, Micro-devices, Mar. 1996, pp. 146-147.
NEC Corporation
Picardat Kevin M.
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