Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Patent
1998-11-12
2000-10-17
Abrams, Neil
Electrical connectors
Including elastomeric or nonmetallic conductive portion
Adapted to be sandwiched between preformed panel circuit...
H01R 458
Patent
active
061322261
ABSTRACT:
A structure for mounting a semiconductor device or similar electronic part to a printed circuit board and a method therefor are disclosed. Electrodes are formed on the front of the circuit board while electrodes are formed on the electronic part. The circuit board and electronic part are affixed to each other by adhesive while holding thin metallic wires between their electrodes.
REFERENCES:
patent: 3591839 (1971-07-01), Evans
patent: 4449774 (1984-05-01), Takashi et al.
patent: 4509099 (1985-04-01), Takamatsu
patent: 4642889 (1987-02-01), Grabbe
patent: 4664309 (1987-05-01), Allen et al.
patent: 4667219 (1987-05-01), Lee et al.
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5162613 (1992-11-01), Schoenthaler
patent: 5342999 (1994-08-01), Frei et al.
patent: 5735698 (1998-04-01), Bakker et al.
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 5905638 (1999-05-01), MacDonald, Jr. et al.
Japanese Office Action, dated Jan. 18, 2000, with English language translation of Japanese Examiner's comments.
Abrams Neil
NEC Corporation
Nguyen Son V.
LandOfFree
Structure and method for mounting an electronic part does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structure and method for mounting an electronic part, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and method for mounting an electronic part will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-462755