Structure and method for intergrating microwave components on a

Details Structure and method for intergrating microwave components on a Structure and method for intergrating microwave components on a

1994-12-01

1997-06-17

Niebling, John

Fishing, trapping, and vermin destroying

437209, H01L 2170, H01L 2700, H01L 2160

Patent

active

056396830

ABSTRACT:
A component integration structure (10) for a microwave system includes a silicon substrate (12) having a resistivity greater than about 2,000 ohm-cm. A first die (14) is disposed on the silicon substrate, and a first passive element (20) is disposed on the silicon substrate and electrically coupled to the first die. In addition, a second passive element (22) and a second die (16) may be disposed on the silicon substrate. The second passive element is electrically coupled to the first passive element. An integration method sorts each of a plurality of active devices for placement on either the first die or the substrate depending on which of two different processing flows has the most favorable characteristics for fabricating each particular device.

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