Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-03-15
2005-03-15
Zarneke, David A. (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Reexamination Certificate
active
06867493
ABSTRACT:
One disclosed embodiment comprises a substrate having a top surface for receiving two or more semiconductor dies. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate and at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of a first semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a first substrate bond pad and the printed circuit board. The first substrate bond pad is connected to the first signal bond pad of the first semiconductor die by a first signal bonding wire. The at least one via also provides an electrical connection between the first signal bond pad of the first semiconductor die and a first land that is electrically connected to the printed circuit board.
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Cote Kevin J.
Hashemi Hassan S.
Skyworks Solutions Inc.
Zarneke David A.
LandOfFree
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