Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2006-11-13
2009-08-11
Le, Thao P. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C438S612000
Reexamination Certificate
active
07573115
ABSTRACT:
The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
REFERENCES:
patent: 5149674 (1992-09-01), Freeman, Jr. et al.
patent: 5403777 (1995-04-01), Bryant et al.
patent: 5502337 (1996-03-01), Nozaki
patent: 5700735 (1997-12-01), Shiue et al.
patent: 5736791 (1998-04-01), Fujiki et al.
patent: 5739587 (1998-04-01), Sato
patent: 6187418 (2001-02-01), Fasano et al.
patent: 6313537 (2001-11-01), Lee et al.
patent: 6365970 (2002-04-01), Tsai et al.
patent: 6524942 (2003-02-01), Tsai et al.
patent: 6632478 (2003-10-01), Gaillard et al.
patent: 6762495 (2004-07-01), Reyes et al.
patent: 6818540 (2004-11-01), Saran et al.
patent: 6900395 (2005-05-01), Jozwiak et al.
patent: 6987316 (2006-01-01), Reddy et al.
patent: 7009280 (2006-03-01), Angyal et al.
patent: 7115985 (2006-10-01), Antol et al.
patent: 7301231 (2007-11-01), Antol et al.
patent: 7355273 (2008-04-01), Jackson et al.
patent: 7372168 (2008-05-01), Wu et al.
patent: 7397127 (2008-07-01), Lin et al.
patent: 2001/0010404 (2001-08-01), Ker et al.
patent: 2002/0000668 (2002-01-01), Sakihama et al.
patent: 2002/0179991 (2002-12-01), Varrot et al.
patent: 2004/0016949 (2004-01-01), Semi
patent: 2007/0145548 (2007-06-01), Park et al.
Farooq Mukta G.
Jung Dae Young
Melville Ian D.
International Business Machines - Corporation
Le Thao P.
Li, Esq. Todd M. C.
Scully , Scott, Murphy & Presser, P.C.
LandOfFree
Structure and method for enhancing resistance to fracture of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structure and method for enhancing resistance to fracture of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and method for enhancing resistance to fracture of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4113337