Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-09-20
2009-11-10
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S704000, C174S016100, C174S016300, C165S080300
Reexamination Certificate
active
07616445
ABSTRACT:
One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.
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Cheng Hsin-Yu
Lin Yao-Nan
Chervinsky Boris L
NVIDIA Corporation
Patterson & Sheridan LLP
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