Structure and method for connecting leads from multiple chips

Details Structure and method for connecting leads from multiple chips Structure and method for connecting leads from multiple chips

1994-06-01

1995-10-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361775, 361807, 257690, 174261, H05K 702

Patent

active

054615445

ABSTRACT:
A plurality of integrated circuit devices are bonded to a substrate. Signal traces for corresponding pins of the devices are run to the same location, but are not electrically connected. They are, however, located in close physical proximity at a designated location. At this designated location, a properly shaped and sized contact can be used to contact all of the corresponding traces simultaneously, allowing parallel burn-in of all devices on the substrate to be performed. The devices can still be tested individually after burn-in. Once functionality of the overall subsystem has been confirmed and encapsulation completed, a permanent contact can be made at the designated location to all traces simultaneously so that the devices will be in parallel, and the substrate can be encapsulated to form a completed subsystem.

REFERENCES:
patent: 4934045 (1990-06-01), Mase

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