Structure and manufacturing method of substrate board

Details Structure and manufacturing method of substrate board Structure and manufacturing method of substrate board

2008-01-04

2009-12-29

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S251000, C174S253000, C361S702000, C361S704000, C361S709000, C361S710000, C361S711000

Reexamination Certificate

active

07638714

ABSTRACT:
A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn.

REFERENCES:
patent: 4876120 (1989-10-01), Belke et al.
patent: 4963701 (1990-10-01), Yasumoto et al.
patent: 5224017 (1993-06-01), Martin
patent: 7358665 (2008-04-01), Yu et al.
patent: 2004/0091011 (2004-05-01), Liu
patent: 2005/0019535 (2005-01-01), Vasoya et al.
patent: 2005/0019541 (2005-01-01), Vasoya et al.
patent: 2006/0065421 (2006-03-01), Arai et al.
patent: 2006/0192194 (2006-08-01), Erchak et al.
patent: 2008/0116809 (2008-05-01), Park
patent: 2008/0298021 (2008-12-01), Ali et al.
patent: 2009/0027857 (2009-01-01), Dean et al.

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