Structure and manufacturing method of an image TFT array

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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C257SE31047, C257S049000, C257S079000, C257S296000, C257S298000, C257S059000, C257S414000

Reexamination Certificate

active

07439544

ABSTRACT:
The present invention provides a manufacturing method of an image TFT array, which includes providing a substrate including a thin film transistor region, a storage capacitor region, a pad region, and a common electrode region, forming a photoresist layer on the substrate, and performing a photolithographic and etching process by utilizing a half-tone mask to pattern the photoresist layer to define a position of a through hole on the storage capacitor region and form the photoresist layer of a first thickness on the thin film transistor region and the photoresist layer of a second thickness on the region between the thin film transistor region and the storage capacitor region, wherein the first thickness is greater than the second thickness.

REFERENCES:
patent: 6465824 (2002-10-01), Kwasnick et al.
patent: 6465861 (2002-10-01), Liu et al.
patent: 6680216 (2004-01-01), Kwasnick et al.
patent: 6764900 (2004-07-01), Shih
patent: 7205571 (2007-04-01), Ahn et al.
patent: 588463 (2004-05-01), None

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