Structure and fabrication method for interconnecting light emitt

Details Structure and fabrication method for interconnecting light emitt Structure and fabrication method for interconnecting light emitt

1997-09-02

1999-03-23

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257 99, 257 88, 257 81, 257 98, 345 82, 345 84, 359 34, 385 14, G09G 332, G03H 100

Patent

active

058864016

ABSTRACT:
A light emitting diode (LED) interconnection package includes an LED situated on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces; a polymer film overlying the contact surface and having via openings; a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.

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