Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2009-08-04
2010-06-22
Hoang, Quoc D (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S108000, C257SE23051, C257SE31131, C257SE33075
Reexamination Certificate
active
07741160
ABSTRACT:
Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.
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Euzent Bruce
Li Yuan
Mahadev Vadali
Wang Wen-chou Vincent
Altera Corporation
Hoang Quoc D
Weaver Austin Villeneuve & Sampson LLP
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