Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-06-05
1999-08-17
Copenheaver, Blaine R.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156252, 156292, 156295, 1563042, 1563043, 1563045, B29C 6500, B32B 312
Patent
active
059388757
ABSTRACT:
An improved panel structure wherein at least one face of the panel is perforated with small holes and where it is desirable to minimize the number of holes that get filled in with adhesive. For example, an improved noise reducing acoustic panel (30) (FIG. 3) constructed of a nonperforated inner skin (14), a perforated outer skin (16) having small holes (18), two sections (12, 12a) of honeycomb core material which are bonded or spliced together by a partially or fully encapsulated foaming adhesive (32e) which has been foamed and expanded, thereby forcing a supported film adhesive (34c) against the walls (24, 24a) of the honeycomb cells in the area of the gap (22) whereby the supported film adhesive (34c) bonds to the walls (24, 24a) of the honeycomb cells in the area of the gap (22). The nonperforated inner skin (14) has been adhesively bonded by a film adhesive to the honeycomb core sections (12, 12a). The perforated outer skin (16) has been adhesively bonded by an unsupported film adhesive to the honeycomb core sections (12, 12a). Encapsulated foaming adhesive (32e) has no horizontal bleed out and it fills a minimum number of the small holes (36, 36a) in the perforated outer skin (16), thereby maximizing the desired noise reducing capability of the acoustic panel (30). As compared to the prior art acoustic panel (10) (FIG. 1), the acoustic panel (30) (FIG. 3) of the invention has a smaller number of filled holes (36, 36a) and a smaller splice width. It also has a neater appearance and a more uniform pattern of filled holes (36, 36a).
REFERENCES:
patent: 4054477 (1977-10-01), Curran
patent: 4257998 (1981-03-01), Diepenbrock, Jr. et al.
patent: 4265955 (1981-05-01), Harp et al.
patent: 4335174 (1982-06-01), Belko
patent: 5455096 (1995-10-01), Toni et al.
patent: 5518796 (1996-05-01), Tsotsis
patent: 5776579 (1998-07-01), Jessup et al.
Boeing Process Specification BAC 5514-590, "Bonding With Foaming Adhesives," pp. 1-7, Jul. 1995.
Boeing Process Specification BAC 5514-5137, "Structural Bonding With BMS5-137 Adhesives," pp. 1-12, Dec. 1994.
Boeing Material Specification BMS 5-90M, "Foaming Adhesives," pp. 1-20, Jul. 1995.
Boeing Material Specification BMS 5-137D, "Structural Adhesive For Acoustic Panels -350 F Service," pp. 1-24, Dec. 1994.
Ronald Bliss, Boeing News, "New inlets to diminish decibels of 747 P&W jets," pp. 8, Sep. 1995.
Jessup Jerry R.
Perez, Sr. Richard
Copenheaver Blaine R.
Cullom, Jr. Paul C.
The Boeing Company
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